This is a case where prevention is worth a pound of cure.  
     How much epoxy do you have to remove?  Are you using oversize 
     copper foil, or at least a release sheet that extends beyond the 
     panel edges?  Minimize the amount of epoxy on the plates first.
     This type of process only allows epoxy around the tooling holes.
     
          I have found the best method of removal is to coat the 
     separator plates with a good mold release before layup.  After 
     breakdown, the residual epoxy around the holes can be scraped off 
     quickly and easily (try a sharpened putty knife; it's safer than 
     razor blades).  If desired (we do), the plate can then be passed 
     through a plate scrubber.
     
          We use Tadco Tuflube 3C, which is mixed with water and put 
     in the rinse chamber of our plate scrubber.  After breakdown, the 
     operators quickly scrape the tooling holes and feed the plates 
     into the scrubber.  We use an Ishii Hyoki scrubber, and this does 
     not degrade the surface of the plates.  As the plates pass 
     through the rinse, they are coated with mold release at the same 
     time, dried, and returned to the lay-up room.