---------------------------- Forwarded with Changes ---------------------------
From: lmendoza::(LMENDZ) at ~FABRIK
Date: 12/6/96 5:22PM
*To: TECHNT at ~FABRIK
Subject: ASSY: Chip on Flex
-------------------------------------------------------------------------------
If you're going to wire bond the chip to the flex and then 
encapsulate, be careful to use either an adhesiveless flex 
laminate material or one with a high modulus adhesive like 
pehnolic:butyral. This reduces the parasitic absorption of 
bonding energy by soft adhesives like acrylic and helps keep the 
flex pads from squirming around during bonding.

     
     Andy Magee - Applications Engineer
     Rogers - Circuit Materials
     Tel: (602) 917-5237
     Fax: (602) 917-5256
     E-Mail: [log in to unmask]
     Website: http//www.rogers-corp.com/cmu
     
     ////////////////////////////
     //  SERVICE TO THE LINE,  //
     //  ON THE LINE,          //
     //  ON TIME.              //
     ////////////////////////////




______________________________ Forward Header
__________________________________
Subject: ASSY: Chip on Flex
Author:  lmendoza::(LMENDZ) at ~FABRIK
Date:    12/6/96 5:22 PM


From: [log in to unmask]
Date: Fri, Dec 6, 1996 5:22 PM
Subject: ASSY: Chip on Flex
To: TechNet
I am investigating the chip-on-flex process for a new product that 
our company will be doing. I would appreciate if anybody could share 
some of their "live" experiences with this technology, the issues 
involved with this technology.
     
Best regards,
Luke Mendoza
Electronic Assemblies, Inc.
     
--
Luke Mendoza - http://iphil.net/~lmendoza, http://www.users.irf.ph.net/~lbm
     
1--> No man can serve two masters, yes-men can serve hundreds.
     

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