The reasoning behind this testing would be to "ensure" the peel strength is
sufficient for constructions with foil lamination.  In a foil lamination
construction, you would not be testing something previously tested at the
raw material level, because "newly created" laminate is holding the surface
conductors.  See IPC-T-50 definition of foil lamination.  Note that per
IPC-RB-276, para. 3.10.4, this applies only to Military Class 3 product
built with foil lamination.

>     
>     Does anyone have any data regarding the bond strength suface mount 
>     test listed in Table 18 of IPC-RB-276.  Aren't we testing peel 
>     strength which has already been tested at the raw material level?
>     Thanks for your attention.
>     [log in to unmask]
>     
>
>
>
David Estes
PCB Commodity Management
Texas Instruments
ph: 214-997-2942
fax: 2214-997-2656
e-mail:  [log in to unmask] (or the above address)