Juanita.
Could you(anyone) share the pad geometries for Caps or Rs that you use 
when components get smaller.
And what type of paste and stencil size you use to keep enough paste in 
the other bigger components?

I have found that you cannot cut stencil thickness without loosing solder 
paste in filets on bigger parts. Also,  if the pad size is too big I get 
solder balls.
Any suggesting out there?
Thank you





Alex Basauri
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Trimble Navigation LTD
The GPS Solution!!
645 N. Mary Avenue B6
Sunnyvale, CA 94086
(408) 481-8751 
(408) 481-6077 Fx

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