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| Date: | Mon, 09 Sep 1996 18:10:01 +0500 |
| Content-Type: | text/plain |
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with respect to above mentioned problem i wud like to clarify that the
said defect is being noticed only in ML boards.The said problem is not
noticed to such an extent in DOUBLE SIDED RIGID boards for the same
complexity of the Product. Therefore we suspect strongly the ML lamination
process as a POTENTIAL CAUSE.Could any one throw some light on this
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