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Subject:
Fwd: RE: ASSY: Cu Ni Sn board finishes
From:
Chris Stack <[log in to unmask]>
Date:
07 Aug 96 10:22:34 -0400
Content-Type:
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I have seen a lot of talk on Technet recently regarding Cu Ni Sn board 
finishes.  Is this the same thing as what I have heard called "Soldermask 
over Tin/Nickel" or "The Santa Clara Process"?  If so, does anyone have a 
summary of the benefits/problems associated with this process?
   
Thanks,

==========================================================
  Chris Stack
  ext. 231                       
  [log in to unmask]                    
  CD Electronics, Inc.                   
  Printed Circuit Board Designer and Purchasing Agent 
==========================================================
To understand the things that are at our door is the best
preparation for understanding those that lie beyond.
                                              -Hypatia
==========================================================

             ********** ORIGINAL MESSAGE FOLLOWS **********

>We appreciate your Feedback Mr. Anderson, one more question, what is
>your surface prep (predip) prior to Tin plating.
>Regards / Wolfgang.

Wolfgang;

>From Nickel we have dragout rinses followed by a spray rinse, then
to a 10% sulfuric pre-dip before Tin plate. After copper plate we
also have a light microetch before the Nickel to eliminate the
possibility of peeling at the Cu/Ni interface.

Regards
George
----------------------------------------------------------------
Uvonics Co. Inc.                              [log in to unmask]


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