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| From [log in to unmask] Wed Aug 7 12: |
48:08 1996 |
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I have seen a lot of talk on Technet recently regarding Cu Ni Sn board
finishes. Is this the same thing as what I have heard called "Soldermask
over Tin/Nickel" or "The Santa Clara Process"? If so, does anyone have a
summary of the benefits/problems associated with this process?
Thanks,
==========================================================
Chris Stack
ext. 231
[log in to unmask]
CD Electronics, Inc.
Printed Circuit Board Designer and Purchasing Agent
==========================================================
To understand the things that are at our door is the best
preparation for understanding those that lie beyond.
-Hypatia
==========================================================
********** ORIGINAL MESSAGE FOLLOWS **********
>We appreciate your Feedback Mr. Anderson, one more question, what is
>your surface prep (predip) prior to Tin plating.
>Regards / Wolfgang.
Wolfgang;
>From Nickel we have dragout rinses followed by a spray rinse, then
to a 10% sulfuric pre-dip before Tin plate. After copper plate we
also have a light microetch before the Nickel to eliminate the
possibility of peeling at the Cu/Ni interface.
Regards
George
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