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1996

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Subject:
CONFERENCE PAPER
From:
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Date:
Thu, 28 Nov 1996 11:13:48 +0000
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Does anyone have a copy of the NATIONAL ELECTRONIC PACKAGING AND
PRODUCTION CONFERENCE PROCEEDINGS OF THE TECHNICAL PROGRAM(WEST
AND EAST) 1996 '(NEPCON WESTWEST'96) I need the following
articles. Worldwide trends in flip chip developments:by
Vardman_EJ & Goodman_TW (VOL.2 pp 973-975)   and











         Laminate technology update for multichip modules. by:Trent_J 
         pp922-929
         
         Frank Frimpong 
         [log in to unmask]
                         OR
         [log in to unmask]
         FAX 44 (0) 01782787259
          
         Tanx in advance

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