We pot electronic boards that are sent downhole.  Will this workshop 
     cover packaging for boards that undergo high temp and high pressure? 


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Subject: IEEE Electronic Packaging Workshop
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Date:    1/29/96 9:29 AM


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CALL FOR PRESENTATIONS: INTERNATIONAL WORKSHOP ON ELECTRONIC PACKAGING 
Sponsored by the IEEE Computer Society.  
     
The workshop dates are May 8-10, 1996 at Tamiment Resort and Conference 
Center in Tamiment, Pennsylvania.  It is about an hour's drive from 
Newark Airport in the foothills of the Pocono Mountain Region.
     
In accordance with IEEE Workshop rules, this is much more informal than 
a major conference.  This means that no written document is required, 
no cameras are allowed, and the presenters cannot be recorded.  These 
rules are intended to encourage an "off the record" technical 
interchange that should be a learning experience for all involved. 
There are no concurrent sessions so every attendee can see every 
presentation.
     
Presentations are requested for the following five sessions: 
SESSION 1: Packaging Technology and Opportunities for Innovation 
SESSION 2: Present & Future Client and Small Server Systems 
SESSION 3: Networks and Communications Systems
This session is related to telephony's convergence with computers and 
network systems.  POSSIBLE SUBJECTS: Network system architectures and 
their packaging ramifications, LAN and WAN trends and packaging 
requirements, hardware description and requirements for data storage 
and switching nodes in global networks (backbones) such as Internet, 
requirements for combining voice and data in a single network, 
packaging for ATM systems, military networks, wireless networks 
(cellular systems), fibreoptics networks, set-top boxes, etc. 
Additional topics are welcome.
POSSIBLE OVERVIEW PAPER: Future trends for networks, the need to 
handle voice and data simultaneously, multimedia requirements (e.g., 
video on demand), bandwidth needs and their implied impact upon 
packaging, etc.
SESSION 4: Panel Discussion - Future of the Packaging Business 
SESSION 5: Large Server and Parallel Processor Systems
     
The session chairs and workshop committee include experts from 
Alcatel, Digital Equipment Corporation, Ericsson, Fujitsu, Hitachi, 
IBM, Intel, Interconnection Decision Consulting, Silicon Graphics, 
Toshiba, and Unisys.
For more information please contact:
     Bryan Douglas, Applications and Technology Group 
     Alcatel Network Systems
     825 Security Row, Mail Stop 406-246
     Richardson, TX  75081
     tel +1 214 996 5945
     fax +1 214 996 6867
     email [log in to unmask]   OR   [log in to unmask]