Just a reminder for those interested in high density array packaging
technologies ...

>To: [log in to unmask]
>From: "Gary J. Arnold" <[log in to unmask]>
>Subject: Announcement for your e-mail comm network
>
>The State University of New York at Binghamton, Watson School of Engineering
>will offer its seventh annual Electronics Packaging Symposium at the
>Binghamton, NY campus June 27 and 28, 1996. This program has become
>extremely popular over the past few years attracting about a hundred
>engineers and technical personnel from across the U.S. The 1996 program will
>focus on a number of strategic issues relating to the evolution of laminate
>chip carrier technologies.

Some of the key papers are: Array Package Attachment Reliability (A. Mawer,
Motorola);
Design & Assembly Issues for Laminate Chip Carriers (M. Jimarez, IBM); Flip
Chip-to-FR$: A Plan for Introduction into Volume Manufacturing (R. Kubin,
Northern Telecom); ITRI/October Project Initiative on Microvia Techniques
(J. Fisher, ITRI). Examples from the two day conference with 8 sessions. 

 A complete brochure may be obtained by calling The Watson
>School Office of Continuing Education at (607) 777-2154 or by Faxing your
>name and address to them at (607)- 777-4411. Early registration is
>recommended as enrollment is limited to preserve the opportunity for
>participant interaction with the presenters.
>
>------------------------------------------
>Gary J. Arnold
>Binghamton University
>Thomas J. Watson School of Engineering and
>Applied Science
>Office of Continuing Education
>Phone:607 777-2154
>Fax:  607 777-4411
>E-mail: [log in to unmask]
>--------------------------------------
>
>
Ron Gedney
[log in to unmask]
607-777-4335, fax 4683