The IPC-SM-782 task group is currently working on two projects:

1) an amendment to the current revision A of the IPC-SM-782. This will 
correct typos and reduce the fabrication tolerance and placement accuracy 
from 0.2 mm to 0.1 mm. This should reduce the land patterns from some of 
the components.

2) a B revision of the document. This will include new components, 
including BGAs. 

The task group is scheduled to meet in July, in Portland, and again in 
October, at IPCWorks. The consensus building process does takes time. The 
amendment should be published after the July meeting, but a date has not 
been set for the publication of the B revision.

****************************************
Lisa M. Williams
Technical Staff
IPC
2215 Sanders Road
Northbrook, IL 60062
phone: (847) 509-9700 x 379
fax:   (847) 509-9798
email: [log in to unmask]
****************************************



On Mon, 17 Jun 1996, Gary Ferrari wrote:

> Many of the patterns in the SMT Plus, Inc pattern book do not conform to the
> IPC-SM-782 standard, but were developed by SMT Plus, Inc. The pending
> revision to IPC-SM-782 includes discussions and land patterns for the BGA
> deveices. I am not sure of the release date, but I'm sure that the IPC can
> give you some information.
> 
> 
> At 04:16 PM 6/14/96 -0700, David Ricketts wrote:
> >I have found an excellent source of land pattern information, covering 
> >all surface mount devices, including BGA, to be the SMT Component and Land 
> >Pattern Book, from SMT Plus, Inc. For about $300, you get all the 
> >patterns you could ever want, conforming to IPC and designed by the 
> >industry leader of practical SMT designs, and a free update service for 
> >new patterns. No formulas, just ready to use info.
> >
> >I don't know of an on-line address, but their old fashioned telephone 
> >number is 408-438-6116.
> >
> >djr
> >
> > On Fri, 14 Jun 1996, John Gully wrote:
> >
> >> I am looking for sound information regarding the land pattern  
> >> of PBGA and CBGA components, specific to bareboard fabrication.  
> >> I have contacted several sources (Motorola, IBM, etc.) and looking 
> >> for more info.  IPC-SM-782 does not cover this type of component 
> >> geometry.  Has IPC developed or revised -782 to include BGA land
> >> patterns?  If so, I need a copy. All sources of information are 
> >> welcomed.  Thank you.
> >> 
> >> John Gulley  - PE
> >> Dallas, TX
> >> 
> >> 
> >
> >
> Regards,
> 
> Gary Ferrari
> Tech Circuits
> (203)269-3311
> [log in to unmask]
> 
>