There is no real issue as none of the plastic components are hermetically
sealed.  The lack of hermetic seal predictably causes a problem, called
"popcorning" where the top of the component pops off during reflow, due to
the absorbed moisture being vaporized.  The IPC is working on methods of
moisture sensitivity classification for such components and there are
numerous bake-out schedules being applied to avoid the problem during
manufacture of pwa's.  Regards, Jim Moffitt  


At 10:03 AM 9/30/96 -0700, you wrote:
>
>Hello there,
>
>I am not too familiar with hermeticity issues and would
>like to know about the existence of any potential
>hermeticity problems with PBGA's and TSOP's.
>We are looking to use these package types and I'd
>be grateful if anyone out there could let me know
>about their experience
>
>Thank you
>____________________________________________________
>Sanjay Rajan			Ph: (716) 242-3923
>Senior Components Engineer	Fax:(716) 242-3174
>Harris RF Communications
>
>
>
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