TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Melinda Robinson <[log in to unmask]>
Date:
Wed, 6 Nov 1996 08:50:27 -0600 (CST)
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (34 lines)


---------- Forwarded message ----------
Date: Wed, 06 Nov 1996 08:23:55 +0000
From: Howard M. Relles <[log in to unmask]>
To: [log in to unmask]
Subject: polyimides

I afraid I cannot be of any help re: the need you expressed to bond 
polyimide to kovar unless maybe you tell me a little bit about what 
the chemical makeup is of kovar.

I would also like to ask you the following re: polyimides of interest 
to me and my clients:

I'm looking for sources of information on the costs of various 
polyimide stock shapes and finished parts made out of UPIMOL (raw 
mat'l from Ube), VESPEL (raw mat'l from DuPont), P84 (raw mat'l from 
Imi-Tech GmbH), and PETI-5 (a relatively new NASA raw material). I'd 
appreciate any informaton or leads to people you know who might be 
good networking contacts in this area. My e-mail addresses are 
[log in to unmask] or [log in to unmask]   My phone is 518-374-8317. 
Thanks very much.
Dr. Howard M. Relles

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2