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1996

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Subject:
From:
David Bergman <[log in to unmask]>
Date:
Fri, 25 Oct 1996 16:34:13 -0500 (CDT)
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (56 lines)
Maybe someone on the net can help
Thx
Dave Bergman, IPC

Date    24/10/96
Subject    Tin Lead etch resists
>From    Martin Goosey
To    Jean Hebeisen

                      Subject:                              Time:  2:54 pm
  OFFICE MEMO         Tin Lead etch resists                 Date:  9/10/96
Jean, thanks for your offer of help! I sent the message below to Jon Holmen but
it would not connect and I need some help on tin-lead etch resists.  I would be
grateful if you could pass this message on to the appropriate persons.  Many
thanks in advance for your help.  Regards, Martin Goosey, Shipley
...................................
Jon, I am working on a PCIF Environmental group looking at tin/lead etch
resists
and have been tasked with reporting on the following questions;

What is the minimum acceptable tin/lead etch resist thickness useable in
practice?  We have people using anything from 5 to 15 microns and obviously
need
to get people to use a minimum thickness to minimise waste and treatment
costs as
well as environmental impact.

How practical are lead free/or reduced lead alternatives e.g. pure tin?

What options are there for tin/lead stripping solutions that might be capable
of
recycling the dissolved metals?

Have you or anyone else at the IPC looked at these issues and if so are there
any
references or reports you could recommend.  I would be grateful for any
feedback
you can give me.  I would also be grateful if you would pass this message to
any
colleagues that might also have information.
With many thanks in advance for your help.

Martin Goosey, Shipley Europe,Coventry.




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