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Subject:
Cu on FR-4 Laminates
From:
"KNAPP, CLARENCE W. WH:2478" <[log in to unmask]>
Date:
Thu, 25 Jan 96 16:46:23 -0800
Content-Type:
text/plain
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We are the design agent and user of printed circuit boards. Just recently 
one of our board suppliers requested a material change 
from: 	Rolled & Annealed Copper {IPC-MF-150, GR 7} on both sides 	of 
0.031" FR-4 Laminate.

to: 	Electrodeposited Copper {IPC-MF-150, GR 1} on both sides 	of 0.031" 
FR-4 Laminate.
 	
			OR

	Electrodeposited HTE Copper {IPC-MF-150, GR 3} on both 	sides of 0.031" 
FR-4 Laminate.

My question is which of the above material configurations is the most 
available and the most cost efficient.

Thank You One And All

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