We are the design agent and user of printed circuit boards. Just recently one of our board suppliers requested a material change from: Rolled & Annealed Copper {IPC-MF-150, GR 7} on both sides of 0.031" FR-4 Laminate. to: Electrodeposited Copper {IPC-MF-150, GR 1} on both sides of 0.031" FR-4 Laminate. OR Electrodeposited HTE Copper {IPC-MF-150, GR 3} on both sides of 0.031" FR-4 Laminate. My question is which of the above material configurations is the most available and the most cost efficient. Thank You One And All