TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Mon, 26 Feb 96 07:55:30 PST
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines)
     Another option that works quite well is using clear (unpigmented) 
     soldermask and covering the fiducials with the soldermask.


______________________________ Reply Separator _________________________________
Subject: RE: Exposed Copper on Assemblies
Author:  [log in to unmask] at corp
Date:    2/26/96 7:48 AM


Reflowing solder paste on fiducials and in-circuit test pads shouldn't cause 
any problems.  We've been performing ICT on assemblies with solder on the test 
pads for years.  I can't speak for all, but I know that the majority of 
component placement systems can read solder coated fiducials quite well.
     
Jim Marsico
[log in to unmask]
     



ATOM RSS1 RSS2