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| Date: | Tue, 26 Nov 1996 08:10:47 +0200 (IST) |
| Content-Type: | text/plain |
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Hello Technet !
We intend to switch our PTH process from thin copper electroless plus
electrolytic strike to thick ( hot ) electroless , 2 microns thick . The
line will be loaded with baskets , so we do expect the PCBs will be
oxidized.We are considering some kind of chemical treatment prior to dry
film lamination instead of pumice scrub.Wjhat kind of treatment is recommended ?
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