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| Date: | Sun, 21 Jul 1996 16:38:52 +0800 |
| Content-Type: | text/plain |
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I work for a PCBA subcon in the Philippines, and we are currently developing a project that would require using a very thin PCB. I would like to know the limitations of the HAL process, what minimum PCB thickness (FR4) can it handle? Is there any low-cost alternative process (other than bare copper) for surface treatment of such boards? Any help would be greatly appreciated.
--
Luke Mendoza
Electronic Assemblies, Inc.
http://www.globe.com.ph/~eai
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