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Subject:	RE: Disscussion on seepage /resist lifting problem in 4/4mil a nd 5/5 miljobs..
From:	"Hodgson, Pete" <[log in to unmask]>
Date:	Mon, 09 Sep 96 09:00:00 EDT
Content-Type:	text/plain
Parts/Attachments:	text/plain (53 lines)


I would suggest that it is not so much a lamination issue as it is an   
exposure issue.  Keep in mind that with double-sided material, light may   
penetrate the laminate and in essence, expose your panel from both sides   
if you are not using a UV-block enhanced laminate.  In a multilayer,   
there are typically power and ground planes which would block any light   
from coming through the panel, thus lessening your actual exposure of the   
laminate.  We found this an especially perplexing problem a couple years   
ago when we were first working with LPI Solder Mask.


 ----------
From:  TechNet-request[SMTP:[log in to unmask]]
Sent:  Monday, September 09, 1996 6:10 PM
To:  technet
Subject:  Disscussion on seepage /resist lifting problem in 4/4mil and   
5/5 miljobs..



    with respect to above mentioned problem i wud like to clarify that   
the
said defect is being noticed only in ML boards.The said problem is not
noticed to such an extent in DOUBLE SIDED RIGID boards for the same
complexity of the Product. Therefore we suspect strongly the ML   
lamination
process as a POTENTIAL CAUSE.Could any one throw some light on this

   


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