You certainly will not get the concave solder fillet without surface pads,
but through-hole connections have significant redundancies as compared to SMT
solder joints and that should not adversely impact reliability. This of
course assume that the design is otherwise properly designed. Since you still
have pads on the side from which repairs are done, repair operations should
also not be impacted. 

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 201-543-2747
E-Mail: [log in to unmask]
   


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