You certainly will not get the concave solder fillet without surface pads, but through-hole connections have significant redundancies as compared to SMT solder joints and that should not adversely impact reliability. This of course assume that the design is otherwise properly designed. Since you still have pads on the side from which repairs are done, repair operations should also not be impacted. Werner Engelmaier Engelmaier Associates, Inc. Electronic Packaging, Interconnection and Reliability Consulting 23 Gunther Street Mendham, NJ 07945 USA Phone & Fax: 201-543-2747 E-Mail: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************