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Subject: In-process Test coupons
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Does anybody pull coupons immediately after pattern plate and solder float
the coupons as an inprocess check?  If so how many floats and at what
temperature: the usual 550F?  If mutiple floats are used what reject
criteria is used?
======== Fwd by: Tony King / N ========
    Testing at pattern plate for thermal integrity is not the preferred
location, what is the intent of this test ?  Thermal testing of this nature
should be performed after the final heat cycle within the manufacturing
process, typically after hot air solder level.  Thermal test should be used
as an indicator of product integrity after thermal cycling through assembly,
the product after pattern plate is not a representitive sample of the
product as shipped.

Tony King
Elexsys International
603-886-0066