We have received an inquiry, from one of our customers, questioning a
rework method, that we regularly use when incorporating certain types of
engineering changes on Printed Circuit Assemblies.  This method is used when
it is necessary to isolate a surface mount IC lead and add a connection to
that isolated lead. It consists of the following method:

1. Carefully desolder the lead from the pad on the board and reform the IC
lead so that it will not touch the pad.

2.  Lap solder a 30 ga solid wire to the lead mentioned in step 1 and
route the wire to the appropriate connection on the board.

My question is although IPC-R-700C procedure 5.2.4 (pg. 185) allows lap
soldering of wires to surface mount leads,  are there any
documented procedures for allowing a surface mount lead to be lifted from a
pad, reformed so that it does not touch the pad and lap soldering a wire
to it?  We would like to be able to defend our position, to the customer
with documentation that supports this type of rework method.

I'm looking forward to any comments, ideas or documents related to this issue.

Thanks,

Fred Saar


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