One of the only problems we have seen with this 
configuration is the tendancy for negative etchback.

This results in small teardrop voids at the inner layer
hole wall interface.  There is enough copper for continuity
but not for extended service.

If you can section enough (or review Group A type 
microsections) to give yourself a good feeling that this
doesn't occur, then the connections should be sufficient.

Susan Mansilla
Robisan Lab

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