One of the only problems we have seen with this configuration is the tendancy for negative etchback. This results in small teardrop voids at the inner layer hole wall interface. There is enough copper for continuity but not for extended service. If you can section enough (or review Group A type microsections) to give yourself a good feeling that this doesn't occur, then the connections should be sufficient. Susan Mansilla Robisan Lab *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************