TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"DavidRiviere" <[log in to unmask]>
Date:
Wed, 11 Sep 96 14:17:24 PST
Content-Type:
text/plain
Parts/Attachments:
text/plain (75 lines)
     
        Check with Alpha Metals
        

        714-757 0111

______________________________ Reply Separator _________________________________
Subject: ASSY: SMT BOARDS ASSMEBLY ISSUE...
Author:  [log in to unmask] at uucpmail
Date:    9/11/96 2:33 AM


Received: by ccmail from dns.
>From [log in to unmask]
X-Envelope-From: [log in to unmask]
Received: from simon.ipc.org (IPC.ORG) by dns. (5.x/SMI-SVR4)
    id AA26282; Wed, 11 Sep 1996 02:14:59 -0700
Received: from ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI)
     id EAA22442; Wed, 11 Sep 1996 04:24:00 -0700
Resent-Date: Wed, 11 Sep 1996 04:24:00 -0700 
Received: by ipc.org (Smail3.1.28.1 #2)
    id m0v0kw3-0000S2C; Wed, 11 Sep 96 03:46 CDT
Resent-Sender: [log in to unmask] 
Old-Return-Path: <[log in to unmask]> 
Message-Id: <[log in to unmask]> 
Date: Wed, 11 Sep 96 04:46:27 EDT
From: Gopalakrishna Bhat - Manufacturing <[log in to unmask]> 
To: [log in to unmask]
Cc: [log in to unmask]
Apparently-To: [log in to unmask]
Subject: ASSY: SMT BOARDS ASSMEBLY ISSUE... 
Resent-Message-Id: <"Vxf5l1.0.A8D.AndDo"@ipc> 
Resent-From: [log in to unmask]
X-Mailing-List: <[log in to unmask]> archive/latest/6155 
X-Loop: [log in to unmask]
Precedence: list
Resent-Sender: [log in to unmask]
     
Hello,
     
We assemble different types of SMT boards.
The process is stencil printing, component placement and reflow. 
One of our boards is very dense and this takes almost 40
minutes for the placement of the components.  When we 
process this board, the solder paste is just being exposed on the 
stencil which is mounted on the Screen Printer M/C. 
The solder paste's working life on stencil is around 4 hours.
But we need to use the solder paste for a longer period say 25 to 
30 hours. 
     
I need some suggestions to overcome this problem.
     
Thanks in advance,
GKBhat.
     
EMAIL ADDRESS : [log in to unmask]
     
     
*************************************************************************** 
* TechNet mail list is provided as a service by IPC using SmartList v3.05 * 
*************************************************************************** 
* To unsubscribe from this list at any time, send a message to:           * 
* [log in to unmask] with <subject: unsubscribe> and no text.        * 
***************************************************************************
     

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2