Subject: | |
From: | |
Date: | 01 Jul 1996 15:08:27 -0500 |
Content-Type: | text/plain |
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A little more information is needed to reply to this message. When you send
out the board is it still in panel form? If not, some hot air leveling
machines clamp on to the board and if the pads are under the clamp they can
get stuck and ripped off especially if the solder solidifies before the clap
is removed.
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From: [log in to unmask]
To: [log in to unmask]
Subject: Lifted pads from HAL
Date: Friday, June 28, 1996 1:16PM
Dear Technetters
We send some of our boards out of plant to be hot air leveled. When we
receive the boards back we have noticed a very small number of the boards
have isolated surface mount pads that are missing. There is no visible
damage to the surface of the board surrounding the area where the pad
was.The surface of the board under the surface mount pad looks rough like
the pad was pulled off the base laminate. There is evidence that mechanical
force was exerted sufficient to break fibers and remove some of the glass
epoxy with the pad. We are only seeing 1 or 2 pads on a panel which seem to
be in the same general area, however we don't have enough observations to
draw any conclusions. Has anyone seen this condition? What could the
possible cause be?
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