Subject: | |
From: | |
Date: | 2 Apr 1996 14:11:54 -0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Mail*Link(r) SMTP FWD>FAB: PCB Materials
Denis--
Memory seems to recall seeing a product announcment for either a base material
and/or prepreg. Rogers markets a high dielectric constant (dk) material with
a dk in the range of 9-10 for an organic equivalent of alumina.
Many years ago, we made some custom material using a loaded epoxy and glass
fabric (2 plys of a 116), we loaded the resin with a ceramic powder -
titanium dioxide with dk>75 (or some of the titanates) could be used. dk was
about 12, and conductor adhesion was marginal (but acceptable for the
experiment).
Ralph Hersey
e-mail: [log in to unmask]
--------------------------------------
Date: 4/2/96 12:52 PM
From: [log in to unmask]
Item Subject: cc:Mail Text
Hello,
Does anyone have information on PCB materials with a dielectric
constant of 5.5 (or higher)? We are trying to reduce trace impedances
on a standard (59-mil dielectric) thickness 2-layer board while using
reasonable trace widths.
Thanks,
Denis Mori
[log in to unmask]
------------------ RFC822 Header Follows ------------------
Received: by quickmail.llnl.gov with SMTP;2 Apr 1996 12:51:05 -0800
Received: from ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI)
id OAA25299; Tue, 2 Apr 1996 14:42:01 -0800
Resent-Date: Tue, 2 Apr 1996 14:42:01 -0800
Received: by ipc.org (Smail3.1.28.1 #2)
id m0u4Ad1-00008QC; Tue, 2 Apr 96 12:16 CST
Resent-Sender: [log in to unmask]
Old-Return-Path: <[log in to unmask]>
From: [log in to unmask]
X-Openmail-Hops: 1
Date: Tue, 2 Apr 96 10:20:09 -0800
Message-Id: <H00000f1051d6967@MHS>
Subject: FAB: PCB Materials
To: [log in to unmask]
Resent-Message-ID: <"UOiHJ2.0.hCH.gxMOn"@ipc>
Resent-From: [log in to unmask]
X-Mailing-List: <[log in to unmask]> archive/latest/3267
X-Loop: [log in to unmask]
Precedence: list
Resent-Sender: [log in to unmask]
|
|
|