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Subject:
Flip chip bumping alternative
From:
[log in to unmask] (Michel POULIN)
Date:
28 Nov 96 07:33 +0500
Content-Type:
text/plain
Parts/Attachments:
/HPOFFICE/NETMAIL/C3327210.txt (24 lines) 
Frank,

    Your alternative are :

       1-  COB ( chip on board with wire bond )

       2-  If you really want to stay flip chip for speed.  Go for BGA
on ceramic.  This could be very interesting if you have an high I/O
count like 300 solder bump.

       3 -  Flip chip are costly ( more than a standard COB ) however
some way cost probably less like plating the bump.

      Good luck !

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