An important part of surface mount assembly process control is making sure 
the proper amount of solder paste is deposited on the pads.  The amount 
deposited varies due to many factors.  A few of these issues are: The PCB, 
the printing parameters, and the paste characteristics.  Also, the amount of 
paste required to make a solder joint which meets ANSI/J-STD-001 varies from 
pad to pad because of many other issues like: lead coplanarity, amount of 
solder on the pad from HASL, placement accuracy, reflow 
conditions,...........

I am interested in whether there is an industry standard or how others have 
calculated the minimum and maximum volumes of paste required.  I would 
appreciate any comments on this subject.

Bill Barthel
Electronic Assembly Corporation
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(414) 751-3651