Hello

I face a problem with the design of foodprints for wave soldering of SMT
components with partially non wetting surfaces. By using the elasticas as
statet by R.J. Klein Wassink ( Soldering in electronics ) I get endles
pads. I belive I have a serious problem of understanding. R.J. has retired.
Does someone know how I can reach him or is there a Guru that can help me ?
Maybe one of the Philips folks who wrote the Guidelines for Footprint
Design?

Best regards
Guenter