Subject: | |
From: | |
Date: | Mon, 16 Dec 96 12:13:51 -0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Just one note of caution when evaluating CEM3 material. This material
is seen to differ considerably in its mechanical characteristics from
vendor to vendor. Some vendors in the U.S. like GE and Allied signal
have CEM3 which is much different from for instance, Nanya which is an
Asian supplier. CEM3 is typically used in double sided applications.
It is much better for punching than FR-4, it is weaker mechanically,
will warp more through the reflow or wave solder. Price is typically
8% to 10% raw material cost savings than FR-4. Is largely used in
Japan.
Regards:
Steve O'Hara
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: [Fwd: Re: CEM-3 vs. FR-4]
Author: Non-HP-pcbdsn ([log in to unmask]) at HP-Vancouver,mimegw2
Date: 12/16/96 7:53 AM
RwF - ext. 355 - Pat Bailey wrote:
>
> Are there any significant differences/concerns in fabrication, assembly, or
> long term reliability when comparing CEM-3 to FR-4 for double sided PTH
> boards? Is it compatible with carbon direct metallization? In what
> product applications is CEM-3 typically used for double sided PTH boards?
> From what I've been able to gather, it is used quite a bit in Asia but not
> in North America. Why (availability, end product application/reliability
> reqiuirements, no significant cost advantage...)?
>
> Regards,
>
> Pat Bailey
> Zytec Corporation
Pat while in another life we used CEM-3 quite extensivly. The main
problem we has was with Bow & Twist. The material moved around so much
that we ended up switching to FR-4. The movement was around .001 per
linear inch. What our vendors ended up doing was trying to predict the
movement and adjust the drill, Rout & A/W to compensate. An after
thought I have had recently was if we were to have been able to use an
OSP on our boards in our production environment would that have made the
material more stable. We did try an OSP but not for this reason and it
failed in our application using "no clean" assembly techniques.
Steve Collins
PCB Design Supervisor
TSX Corporation
El Paso, TX
Ph: (800) 351-2345
Fax: (915) 543-4898
email: [log in to unmask]
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|