Techneters:

A colleague asked me to send out the following request for information.

Does anyone have any information regarding surface mount plactic device
integrity after the device has been subjected to direct contact with
solder during wave solder processes.  In particular, I am interested in
devices that have experienced extended thermal cycling (small outline
transistor (SOT) and small outline integrated circuits (SOIC) packages)
after wave soldering.  Is the integrity of these types of devices
maintained after exposure to wave soldering?  Does subsequent thermal
cycling effect the integrity?


Thanks in advance for your advice.

Bill


~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Bill Dieffenbacher		   Tel. (607)770-2961
Lockheed Martin Control Systems	   Fax. (607)770-2056
600 Main St.  Room R52F            email [log in to unmask]
Johnson City, NY  13790
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