 
| Subject: | |
| From: | |
| Date: | Mon, 13 May 1996 09:43:04 -0400 (EDT) |
| Content-Type: | text/plain |
| Parts/Attachments: |
|
|
We (IEEE CPMT Society) are planning a workshop on Ball Grid Array, Chip
Scale Packaging and Flip Chip Technologies Oct. 23-25, 1996. Current
thinking on the five sessions are: flip chip technologies; underfill
technologies; power ball grid array (thermal mgmt); assembly technologies;
design methodologies. We are seeking abstracts now, and hope to finalize the
workshop agenda by the end of May. Any recommendations, particularly on
speakers for board preparation, assembly processes for BGA/CSP or Flip Chip
would be appreciated.
Please reply to me directly at:
[log in to unmask]
Telephone: 607-777-4335; fax 607-777-4683.
Ron Gedney
[log in to unmask]
607-777-4335, fax 4683
|
|
|
