We are manufacturing PWBs using SMD, PTH, and Mixed 
     Technology.  Run rates are relatively high and cycle 
     time of product flow is relatively fast.  Boards range 
     from double sided (minimal) to multilayer (most) in 
     single, half panel, and full panel configuration.  Some 
     PWBs, obviously see IR, some flow solder, and some 
     mixed technology both IR and flow solder.  Some parts 
     are commercialized some MIL spec.  Our plant 
     environment is somewhat controlled (air conditioned).  
     Humidity is not high, yet somewhat humidity controlled 
     (ESD reasons).
     
     We are currently observing no adverse affects at IR as 
     a result of not baking PWBs prior to IR.  We are 
     considering eliminating pre-wave bake.  The question is 
     "What experience can you share from eliminating your 
     bake cycle at pre-wave." Positive and negative will be 
     well accepted and appreciated.