Subject: | |
From: | |
Date: | Thu, 10 Oct 1996 11:46:00 -0500 (EST) |
Content-Type: | TEXT/PLAIN |
Parts/Attachments: |
|
|
We also manufacture military electronics and we do not use any preheat when
removing chip capacitors. This practice doesn't seem to be a problem.
Jim Marsico
(516) 595-5879
[log in to unmask]
********************************
* ______ _ _ _____ *
* / ___ | | | | | _____ *
* / /___| | | | | | _____ *
* __/ ____ | | | | |______ *
* |____/ |_| |_| |________| *
* *
* SYSTEMS, INC. *
********************************
===============================================================================
Dear Technet,
We are a military assembly house that employs preheating
plates for ceramic chip rework to reduce the risk of
internal chip delamination from thermal shock.
This has been done per IPC recommendations. However, this step in the
rework process is time consuming and cumbersome. We have done
minor and informal tests to determine the real value of this
practice and found that it really is not needed if the operators take
care in their soldering. If the tip size and heating time is
controlled, there doesn't seem to be an immediate effect or a
temperature cycling effect on the chips.
I am interested to see how widespread the use of preheating
plates actually is. I would like to hear from anyone having
any experience indicating that the process is actually necessary.
(or not necessary)
Thank you in advance for any input.
Jason Spera
Manufacturing Engineering
General Atronics Corporation
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|