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Subject:
Re: re-filling vias with RESIN
From:
Michael Fenner <[log in to unmask]>
Date:
27 Aug 96 16:12:23 EDT
Content-Type:
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Have just come on technet and saw partial on this. I did some work on this and
can pass material and processing details if the subject is still open. It can be
relatively simple.

Mike Fenner
BSP 
---------------------------------------------
On 23 August 1996 Duglas Stewart wrote
SUBJECT:    re-filling vias with RESIN
REFERENCE:  question previously

I believe someone was looking for a way to completely fill vias  with RESIN (not
the sequential blind via type)

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