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1996

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Subject:
From:
Hawk Chen <[log in to unmask]>
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Date:
Sat, 09 Nov 1996 09:17:32 +0800
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Hi my dear friends:

   If somebody have studied the platting process trend ? 

   1. remain the traditional process: PTH + panel plating + pattern
plating + tin         2. tenting process: PTH + panel plating +
image(negative) + etch
   3. direct plating: PTH(no chemical copper procedure) + panel plating
+ pattern            plating + tin plating
   or PTH + image + pattern plating + tin 
   4. direct plating + tenting process
   5. others or mixed upper item.

                                                   Gloria Elec. R & D
Chief
                                                     Hawk Chen

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