Subject: | |
From: | |
Date: | Wed, 22 May 1996 13:18:25 -0400 (EDT) |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
I am not sure if any of you can address this issue, but TechNet seemed
to be a good place for forwarding this message.
Date: Tue, 21 May 96 16:39:43 EDT
From: List Manager 2
To: [log in to unmask]
Subject: Printed Circuit Board Lamination Process
Date: Mon, 20 May 1996 15:00:40 -0700 (PDT)
From: Marc Siegel <[log in to unmask]>
Subject: Printed Circuit Board Lamination Process
A Printed Circuit Board company is looking for ways of eliminating,
recycling or at least reducing two wastes generated during the lamination
process. They are looking for a use for the edge trim which is generated
during the process. About 2 million pounds of edge trim are generated at
their facilities worldwide each year. The composition of the edge trim (in
weight %) is:
Continuous Filament Fiber Glass 40-70%
Epoxy Resin 30-60%
DMF (Dimethyl Formamide) 0.0015% (1500 mg/g)
They are also looking for ways of eliminating, regenerating, or recycling
the resin mixture left at the end of the process. This resin solution
contains a glycidyl ether of brominated bisphenol A, acetone, epoxy resin,
dimethyl formamide, phenyl glycidyl ether, amyl alcohol, and epichlorohydrin.
Thank you,
Marc
===================================================================
Dr. Marc H. Siegel
Project Coordinator, E-LYNX (US EPA ETI Program)
Engineering Process & Information Consulting
12397 Picrus Street
San Diego, CA 92129-4113
Phone: 619-484-9855
Fax: 619-484-9856
E-mail: [log in to unmask]
===================================================================
Dean R. Cornstubble
Research Chemical Engineer
Research Triangle Institute (Pollution Prevention Program)
Phone: 919-541-6813 (Fax, 7155)
http://www.rti.org/units/ese/pp.html
|
|
|