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Date: | Tue, 30 Apr 1996 20:39:20 -0400 |
Content-Type: | text/plain |
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Thad, guide line to specify conductor to PCB edge spacing are:
minimum
standard
Internal layer 0.020 inches + process variation 0.050
inches+ process var.
External Layer 0.100 inches + process
variation
The purpose being not to expose the conductor to the environment that may
cause corrosion or migration.
Pratap Singh
RAMP Labs
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