I am going to assume that you are panel plating and then performing 
a print and etch process with your Hitachi dry film as you did not mention 
anything about plating after resist lamination.  I am also going to assume
that your resist is about 50 microns in thickness (you didn't mention 
this either).  I would recommend evaluating your surface prep prior to 
resist lam. This can be done by performing a break test on the panel 
surface after brush scrub, hold the panel under a water faucet until you 
have sufficient water to coat the panel surface.  Then hold the panel at a 
45degree angle, a thin bead of water should remain on the panel surface 
for a period of 30 seconds.  If this does not happen the panel surface is 
not getting well scrubbed.  Next check your lamination parameters, 
are you meeting the exit temperature requirements recommended by 
Hitachi.  In regards to your printing have you investigated vacuum 
dwell times prior to exposure and do your phototools have acceptable dmin, 
dmax values.  As for developing have you checked your breakpoint recently, 
this is the location in the developing chamber where the film is 
completely removed from the panel. Hitachi should also have a 
specification on this. Another item you might try is to run a board 
through a microetch solution after develop, the copper should become very 
orange (about the color of salmon), if this does not happen or you get 
splotches on the panel you are leaving resist residues on the panel.

There are several other items that would be worthwhile to check, but
I will let other people make their recommendations.



Regards,

Josh Moody
Merix Corp.

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