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| Date: | Mon, 04 Nov 96 18:42:09 EST |
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FROM: James D. Herard
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Subject: goldfinish on PC boards
Wolfgang;
I don't have any specific reports I can point you to, but,
it is well known that if the content of Au in a solder joint
excedes about 4%, the intermetallics formed are brittle
and susceptable to failure. Typically 3-5 microinches
of Au is used. 30 microinches is probably way too thick for
SMT, might be acceptable in some wave applications.
Jim Herard
IBM Microelectronics
James Herard x77026 KBLE/014-3 Quality Engineer
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********* Get it While you Can *********************
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*** Forwarding note from SMTP2 --IINUS1 11/04/96 15:10 ***
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