Address,
     
     We use .020 pitch devices extensively in our designs, 12mil lands with 
     8mil spacings.  The conductors widths coming from these lands are 
     8mils (2.1 Cu thk; .0007 foil and .0014 plating).  In addition to 
     other varibles, I believe the 8mil cond width is robbing much needed 
     heat for solderability.  The 8mil cond width is out of context for 
     such lands and FPT devices.
     
     Q: How much influence does the conductor really have on the wetting of 
        the land in reflow (No heavy copper planes in the 8 layer lay-up)?
     
     Q: Is there a test that can be conducted to determine the amount heat  
        absorbed by the land.
     
     I am in the process of convincing Hardware Design to reduce the 
     conductor width for the reason above, in addition to buying real 
     estate.
     
     Please advise.
     
     John Gulley 
     [log in to unmask]
     972-578-3928
     
     

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