TECHNET Archives

1996

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Subj: OSPs
From:
"Hollandsworth, Ron" <[log in to unmask]>
Date:
Fri, 01 Nov 96 06:50:05 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (17 lines) 
     I agree with Mr. Holton's TechNet message on OSPs.  How 
     about some information sharing on what they are all about.  
     What affect will OSPs have on No-clean soldering processes?  
     How about the affect on SMT processes?  Could OSPs be 
     something PCB suppliers could use to further "guarantee" 
     solderability when PCBs reach their customers?  What about 
     OSPs on components?  Just what are the pros and cons?  

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************

ATOM RSS1 RSS2