We procure microwave boards that to IPC-HF-318 would be Class 3 Type 3. 
  Recently we see some suppliers having problems which result in plating 
voids.  The criteria for voids in a plated through hole are defined but 
voids in the plated edges of the board do not seem to be defined anywhere.

     Question 1.  A void across an interconnect in a normal multilayer is 
real bad but what about a void across the same interconnect when it is a 
ground that goes all the way around the periphery of the finished board?

     Question 2. Does anybody know where plated edge requirements are 
listed?
     Question 3.  Since I can not find what I am looking for in a 
specification, if no specification exists, does anybody have criteria?

          Thanks
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