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1996

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Subject:
FW: Cupric Chloride Etching
From:
Microsoft Windows <[log in to unmask]>
Date:
Sat, 15 Jun 1996 15:34:03 +-800
Content-Type:
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From: 	Microsoft Windows[SMTP:[log in to unmask]]
Sent: 	Friday, June 14, 1996 7:10 PM
To: 	'Technet'; 'Technet'
Subject: 	FAB: Cupric Chloride Etching

Can any one give me the analysis for controlling cupric etching solution. Since this is a generic solution, I have not been able to get all of the analysis. We replenish with H202 and HCL, and do not have a regen. unit. We need the procedures for Cu, H2O2 and HCL.

Thanks in advance.

Scott B. Westheimer, Nelco Products Singapore

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