TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Vijay Sankaran <[log in to unmask]>
Reply To:
Date:
Wed, 30 Oct 1996 18:16:30 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (59 lines)
Hi Technetters:

We all know ANSI J-STD-001 provides the inspection guidelines
for quality. What one never comes across is data correlating
the numbers prescribed in the standard and quality/reliability issues. 
Most of the requirements mentioned in the J-STD-001 are either
cosmetic or not measurable by well-established inspection
techniques. Moreover, the implications of the standard on
board, assembly, and process design is not clearly understood.

I am posting this message to announce that we are initiating
a research effort at Rensselaer that will focus on the above issue.
In 1988 we had performed a study here at Rensselaer on 
this topic which revealed that (post-reflow) component tilt lowered 
the cycles to failure more than any other investigated variable.
This has been published in several articles and books. 
At that time it was felt that the emerging standards would 
include some reliability and performance criteria. (which has
not happened to date!)

We now propose to back parts of the J-STD-001 with quantitative data
as part of the 3rd phase of our Electronics Manufacturing Program.
Other focal areas include Intelligent Manufacturing, Solder/joint
characterization, Innovative soldering approaches, Alternatives to
soldered interconnects, Recycling issues, and Online design and
brokering. This program is an integrated effort with as much 
interaction between the focal areas as applicable. 

A kick-off meeting will be held on November 21st, 1996 at
Rensselear Polytechnic Institute, Troy, NY to incorporate the
opinions and suggestions of the attendees into the research program.
Companies participating in the program will have direct access
to the results and technical publications.

Take a look at our web site
http://www.cieem.rpi.edu
for more information. You can also contact me for further details.

Regards,

Vijay Sankaran
Research Associate
Center for Integrated Electronics and Electronics Manufacturing
Rensselaer Polytechnic Institute
Troy, NY 12180

[log in to unmask]
Phone: 518/276-2721
Fax:   518/276-2990

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2