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1996

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Subject:
Re: Copper plating
From:
[log in to unmask]
Date:
Thu, 19 Dec 1996 21:02:33 -0500
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If the chemistry is alright, the culprit for your nodules may be localized
high current densities. Is this a new PCB code this is occurring on? Perhaps
the average plating current density was calculated wrong, or some design
features promote localized high plating current densities. Are the nodules
concentrated in the same area on the panels? 

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 201-543-2747
E-mail: [log in to unmask]

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