Subject: | |
From: | "Magee, Andrew P" <"andrew.p.magee"@rogers-corp.com> |
Date: | Thu, 31 Oct 1996 17:29:00 -0800 |
Content-Type: | text/plain |
Parts/Attachments: |
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---------------------------- Forwarded with Changes
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From: Andrew P Magee
Date: 10/21/96 12:11PM
To: Mary E. Kennedy
Subject: Abstract
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Our flex analysis software is now available for download at:
http://www.rogers-corp.com/cmu
ABSTRACT
Flex circuits respond to physical forces in relatively
predictable
ways based on the materials used, the thickness of each layer,
and
the environmental conditions. The well-established "art" of flex
circuit design and manufacture allows most flex applications to
be
successful without understanding the details of these
interactions.
As flex circuits are increasingly used for applications that
push
the technology envelope the old rules can sometimes be
insufficient
to insure success. With modern CAD/FEA software a complete
analysis
is possible, but this can be expensive and time consuming, and
typically requires a great deal of skill to achieve accurate
results.
With some simplifying assumptions it's possible to sufficiently
estimate the physical behavior of typical flex circuits by
evaluating the relevant equations. To facilitate completing this
analysis a desktop computer program implementing these equations
is
offered. The program allows for various constructions to be
rapidly
assessed and produces both numeric and graphical results for
comparison. Equations for computing; the neutral axis, moment of
inertia, deflection (bias) force, layer stress/strain, heat
flow,
thermal/hygroscopic stress/strain, and thermal/hygroscopic
expansion are evaluated in this program.
An additional program is included to aid in determining the
coversheet adhesive thickness after lamination to an etched
circuit
pattern, based on adhesive volume.
Andy Magee - Applications Engineer
Rogers - Circuit Materials
Tel: (602) 917-5237
Fax: (602) 917-5256
E-Mail: [log in to unmask]
Website: http//www.rogers-corp.com/cmu
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